The TIA Network: Your Weekly Industry Update from TIA
www.tiaonline.org TIA PULSE - Home
Week of December 10, 2007 • Volume 8, Issue 23 Issue Homepage   |   Past Issues
Join TIA
TIA promotes innovation and a competitive market environment for its member companies.
Learn More >>
TIA Accepting Nominations for 2008 Board

Starting this week, T IA invites member companies to submit nominations for individuals to serve on its 2008 board of directors, which will see four seats open for the coming year. Board terms run three years, and requires a commitment to attend all three triennial meetings, as well as to maintain communications with TIA leadership throughout the term.

TIA's board of directors consists of CEOs, presidents and other senior executives from member companies in good standing. 

If interested, please direct inquiries to Grant Seiffert or Mary Waters at 703.907.7701 and submit a written request, either to Mary at to mwaters@tiaonline.org or via fax at 703.841.2817 by January 15, 2008.

< Back to Top >

Last Week

NXTcomm 2008 Call for Speakers Attracts Industry Attention

More than 800 submissions have been logged by NXTcomm in response to its Call for Speakers, which ended on November 30th. Among the subjects suggested were “Simplifying the Mobile Experience,” “How Telcos Can Benefit from Online Video” and “Transforming and Increasing the Efficiency of Enterprise Workflow,” along with trends and topics related to communications in the enterprise, home networking, IP applications, infrastructure, WiMAX and software as a service.

In the coming weeks, NXTcomm08 Conference Programming Committee members will assess and select the most relevant and informative proposals for consideration by NXTcomm and its conference partners for NXTcomm08 programming sessions. Submission authors will be notified via email in late January 2008.

For more information on NXTcomm08 Conference Programming, contact Jim Forlenza at Jforlenza@NXTcommShow.com or Neil Gaffney at NGaffney@NXTcommShow.com.

< Back to Top >

TIA Speaks, Signs MOU with Korean High Tech Players

TIA Director of International and Government Affairs Michael Nunes took part in a panel discussion on U.S-Korea high tech trade partnerships as part of a delegation of high-ranking Korean trade and technology officials this week, hosted by the U.S. Chamber of Commerce and the U.S.-Korea Business Council in cooperation with the Korea Industrial Technology Foundation (KOTEF).

Nunes spoke Tuesday with moderator Robert C. Reis, Executive Vice President, U.S.-Korea Business Council, and fellow panelists Kyeong-hak Seo, Senior Vice President, Korea Electronics Technology Institute, and Yeong-chul Seok, Senior Research Fellow, Korea Industrial Technology Foundation. They discussed opportunities in high-tech and electronics trade between the two countries, which currently have a trade agreement pending in the U.S. Senate.

Following the meeting, TIA announced the signing of a memorandum of understanding/friendship agreement between KOTEF and TIA, attended by the Korean Minister of Commerce, Industry, and Energy, Mr. Kim Young-ju. The agreement is a first step in what TIA hopes will be series of cooperative programs between the two organizations; the first official program took place on December 5 at TIA headquarters in Arlington, Va., and was designed to help Korean regional innovation officers facilitate cooperation and the exchange of technology and human resources and develop international joint research projects by conducting research on the present status of U.S. industrial technology development. The groups also hope to build personnel networks and channels between Korean and American business entities and government bodies.

For more information on TIA's U.S.-Korea trade efforts contact Michael Nunes at mnunes@tiaonline.org or Tyler Messa at tmessa@tiaonline.org.

< Back to Top >

International Auto Workshop to Promote 'Fully Networked Car'

The International Telecommunication Union (ITU), International Organization for Standardization (ISO) and International Electrotechnical Commission (IEC) will host a major event focusing on information and communications technologies (ICT) in motor vehicles. This event, The Fully Networked Car Workshop 2008, will be held March 5-7, 2008, during the 78th Geneva International Motor Show in Palexpo, Geneva.

Topics to be covered at The Fully Networked Car Workshop 2008 can be found at http://www.itu.int/ITU-T/worksem/ict-auto/200803/.

The ITU has issued a call for abstracts for the workshop, including demonstrations of ICT in automobiles.  Potential presenters should submit a half-page abstract, including the title of the paper and the author’s full name, short biography, address, telephone and e-mail, to tsbcar@itu.int by Friday, November 16, 2007.  Presenters will be notified of their acceptance status by Friday, December 14, 2007, and should respond with presentations no later than Tuesday, January 29, 2008.

For information on the 2005 Workshop, go to http://www.itu.int/ITU-T/worksem/ict-auto/200503/index.html; for information on the 2007 Workshop, go to http://www.itu.int/ITU-T/worksem/ict-auto/200703/index.html

For more information on The Fully Networked Car Workshop 2008, please contact Tyler Messa at +1.703.907.7743 or tmessa@tiaonline.org.

< Back to Top >

 

 

Contact:
Editor: Ian Martinez
TIA
2500 Wilson Blvd.
Arlington VA, 22201
+1.703.907.7723
www.tiaonline.org TIA PULSE - Home