TIA | PulseOnline November 2005, Letter from the President: GLOBALCOMM™ 2006 Exhibitor Planning Meeting Enthusiastically Received

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Telecommunications Industry Association (TIA)

November 2005

Volume 6, Issue 13

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Letter from the President

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Letter from the President

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GLOBALCOMM™ 2006 Exhibitor Planning Meeting Enthusiastically Received

On October 10-12, we held the GLOBALCOMM™ 2006 Exhibitor Planning Meeting. An enthusiastic group of exhibitors…from Cisco and Ciena to Lucent and Motorola…and prospective exhibitors such as Bechtel were present and heard a strategic overview of our new next-generation marketplace and summit, GLOBALCOMM 2006, which will be held June 4-8, in Chicago at McCormick Place, with the exhibit floor open June 5-7.

With GLOBALCOMM 2006, TIA starts a new tradition: delivering world-class events that will connect you to an increasingly global marketplace. For TIA, GLOBALCOMM replaces SUPERCOMM® as TIA's annual event for the industry. GLOBALCOMM 2006 represents a strategic evolution for TIA, not only in its trade show portfolio, but in the association's mission to advance global communications. GLOBALCOMM is a vital component of TIA's strategy to provide total communications solutions for its members via policy advocacy, standards development and a thriving marketplace.

Exhibitor meeting attendees learned about plans for the conference content and structure, discussed attendance marketing and public relations efforts, were briefed on logistical support and TIAConnections™, a new tool for matchmaking services, and walked the facilities to gain perspective on their booth space selection and onsite marketing options. They also heard about GLOBALCOMM™ INDIA 2006 in New Delhi and about the association's USA Pavilions in International Telecommunication Union (ITU) trade shows such as ITU TELECOM WORLD 2006 in Hong Kong and regional ITU exhibitions in Latin America, Europe and Africa.

The mission of GLOBALCOMM is to bring ICT suppliers together with service providers and enterprise users to create a converged, next-generation global communications marketplace. In short, the event will offer the entire buying/selling chain.

I feel this well-received planning meeting is just the beginning of what will be a successful event bringing together all the elements of our expanding communications marketplace. TIA looks forward to working with all of you and invites you to contact us any time so we can be of service as you plan for a successful GLOBALCOMM 2006.

To book exhibit space for GLOBALCOMM™ 2006, June 4-8 in Chicago, and in the exhibitions outside the United States, contact TIA's Tripp Taylor at (703) 907-7000 or email ttaylor@tiaonline.org. For further details, visit www.globalcomm2006.com.

GLOBALCOMM™ is a trademark of the Telecommunications Industry Association (TIA). The Next-Generation Communications Marketplace and Summit will take place June 4-8, 2006, at Chicago's McCormick Place.

SUPERCOMM® is a registered trademark of the Telecommunications Industry Association (TIA) and USTA. The final SUPERCOMM occurred in June of 2005.

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